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Electrical & Electronics Engineering

An Introduction to Electronics Systems Packaging

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An Introduction to Electronics Systems Packaging

01 Introduction and Object of the course

02 Definition of a system and history of semiconductors

03 Products and levels of packaging

04 Packaging aspects of handheld products

05 Case Study (continued); Definition of PWB

06 Basics of Semiconductor and Process

07 Wafer fabrication, inspection and testing

08 Wafer packaging; Packaging evolution

09 Wire bonding, TAB and flipchip-1

10 Wire bonding, TAB and flipchip-2

11 Why packaging& Single chip packages or modules (SCM)

12 Commonly used packages and advanced packages; Materials in packages

13 Advances packages (continued); Thermal mismatch in packages; Current trends in packaging

14 Multichip modules (MCM)-types; System-in-package (SIP); Packaging roadmaps; Hybrid circuits; Quiz on packages

15 Electrical Issues I , Resistive Parasitic

16 Electrical Issues II; Capacitive and Inductive Parasitic

17 Electrical Issues III; Layout guidelines and the Reflection problem

18 Electrical Issues IV; Interconnection

19 Quick Tutorial on packages; Benefits from CAD; Introduction to DFM, DFR & DFT

20 Components of a CAD package and its highlights

21 Design Flow considerations; Beginning a circuit design with schematic work and component layout

22 Demo and examples of layout and routing; Technology file generation from CAD; DFM check list and design rules; Design for Reliability

23 Review of CAD output files for PCB fabrication; Photo plotting and mask generation

24 Process flow-chart; Vias; PWB substrates

25 Substrates continued; Video highlights; Surface preparation

26 Photoresist and application methods; UV exposure and developing; Printing technologies for PWBs

27 PWB etching; Resist stripping; Screen-printing technology

28 Through-hole manufacture process steps; Panel and pattern plating methods

29 Video highlights on manufacturing; Solder mask for PWBs; Multilayer PWBs; Introduction to microvias

30 Microvia technology and Sequential build-up technology process flow for high-density interconnects

31 Conventional Vs HDI technologies; Flexible circuits; Tutorial session

32 SMD benefits; Design issues; Introduction to soldering

33 Reflow and Wave Soldering methods to attach SMDs

34 Solders; Wetting of solders; Flux and its properties; Defects in wave soldering

35 Vapour phase soldering, BGA soldering and DesolderingRepair; SMT failures

36 SMT failure library and Tin Whiskers

37 Tin-lead and lead-free solders; Phase diagrams; Thermal profiles for reflow soldering; Lead-free alloys

38 Lead-free solder considerations; Green electronics; RoHS compliance and e-waste recycling issues

39 Thermal Design considerations in systems packaging

40 Introduction to embedded passives; Need for embedded passives; Design Library; Embedded resistor processes

41 Embedded capacitors; Processes for embedding capacitors; Case study examples; Summary of materials in packaging

42 Chapter-wise summary

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